The European APECS pilot line opens its facilities to companies and research organizations working on advanced chip technologies. Through this open access, organizations can utilize European infrastructure for advanced packaging and heterogeneous integration.
The initiative is part of European efforts to accelerate innovation in the semiconductor sector and strengthen technological capacity within Europe.
European infrastructure for chip innovation
Within the APECS pilot line, research institutes and industry partners are working together on technologies for the next generation of chip systems. The infrastructure focuses on:
Advanced packaging
Heterogeneous integration
System integration of chips
Prototyping and process development
Access to these facilities allows companies to test and develop new technologies in an environment closer to industrial production.
Open access for companies and researchers
Through the open access program, companies, startups, SMEs, and research organizations can make use of the expertise and infrastructure within the APECS network.
This offers opportunities for organizations that, for example:
Want to test a new chip concept.
Want to develop a prototype.
Want to validate packaging or integration technology.
Are seeking access to specialized equipment and knowledge.
More information
Would you like to know more about the open access possibilities of the APECS pilot line? Then visit the APECS website or contact the ChipNL Competence Centre to discuss which facilities align with your innovation needs.