Action Agenda Semiconductor Technologies

This Action Agenda focuses on Dutch innovation efforts in the fields of chip design, advanced packaging (and heterogeneous integration) and semiconductor manufacturing equipment. The Netherlands already has a unique ecosystem and there are opportunities in global growth markets. The Netherlands aims to be an international leader in chip design, advanced packaging and semiconductor equipment by 2035, supported by a resilient ecosystem and strong European cooperation. Innovation Programmes, in which knowledge institutions and industry work together, are an important tool in this regard.

This Action Agenda specifically aims to promote innovation in the Netherlands in three interrelated areas: firstly, the focus is on chip design, with attention to complex, energy-efficient and specialised chips for high-mix, small and medium-volume applications. The emphasis here is on collaboration, standardisation and accelerating development processes. Secondly, the agenda focuses on advanced packaging and heterogeneous integration, with the aim of strengthening the Dutch position in this field, and with an emphasis on panel-level processing and additive technologies. The third domain concerns semiconductor manufacturing equipment, including lithography, metrology, test equipment, sustainable processes and materials, reuse, digital twin technologies and innovative assembly equipment for heterogeneous integration.

The long-term goals and visions include chiplet and heterogeneous integration, neuromorphic computing, 6G, and high-end radar and MRI developments. In addition, efforts are being made to further integrate chip design and advanced packaging with manufacturing equipment that is yet to be developed.

Download the full Action Agenda (Dutch) here

Innovation Programmes

Within this Action Agenda, five Innovation Programmes have been developed that together strengthen the Netherlands' position in semiconductor technology. The programmes focus on chip design, advanced packaging, semiconductor equipment, innovation by knowledge institutions, and chiplets and system design. The content of each innovation programme is explained below.

Innovation Programme 1 | Chip Design

This Innovation Programme focuses on the development of the chips of the future, such as vertically stacked transistors, but also on various other emerging technologies. The programme enables Dutch semiconductor companies to accelerate their innovation speed, with a specific focus on products for RF, analogue & mixed-signal (AMS), AI processors and power & high voltage, combined with advanced CMOS within the Dutch ecosystem.

Innovation Programme 2 | Advanced Packaging

The overall ambition in the Netherlands regarding advanced chip packaging concerns a unique proposition that makes optimal use of the strengths of the Netherlands. This ambition will be realised through two mutually reinforcing pillars. The first pillar concerns a use-case-driven R&D programme, as described here, that accelerates and guides technological development. The second pillar consists of physical facilities, which in principle fall outside the scope of this programme, but which enable the complete conversion from chip to package and upscaling to series production.

The facilities consist of two building blocks: a flexible R&D and concept pilot line and a production line for high-mix, low- to medium-volume production. Together, these building blocks form a continuous route from development to repeatable production. This approach is fully in line with EU and IPCEI priorities to strengthen and scale up pilot and production lines for semiconductors in Europe.

Innovation Programme 3 | Semicon Equipment

The strength of the Dutch equipment sector lies in the strong cooperation within the supply chain. This cooperation is deeply rooted in the culture and offers a competitive advantage. This Innovation Programme aims to strengthen, stabilise and further embed the sector in the national high-tech ecosystem by promoting stronger cooperation along and between the various semiconductor equipment supply chains.

Innovation Programme 4 | Innovation through knowledge institutions

Knowledge institutions operate in the public domain, using public funds for research whose results are shared with society through publications and other channels. Public-private partnerships are a prominent feature of this Dutch research portfolio. Structural coordination between industry and knowledge institutions guarantees effective, high-quality research programmes.

The research programmes carried out within this framework are FutureSemi: Sustaining Dutch Leadership in Semiconductor Equipment, 10x- Factor(y): Towards a Dutch Ecosystem for Neuromorphic Technologies en GREEN-CHIPS: Towards Greener Electronics with Hybrid Technologies and A Next-Generation Semiconductor Platform.

Innovation Programme 5 | Outlook: Chiplets and system design

This Innovation Programme focuses on the opportunities offered by chiplet technologies and heterogeneous integration within the semiconductor industry, with a focus on the Netherlands. The aim is to realise modular chip architectures that lead to better performance, lower costs and higher energy efficiency, particularly for applications in data centres and edge computing.

The application of heterogeneous integration is currently inefficient and unsuitable for mass production due to a lack of design, production and testing methods. Given the rapid global developments and societal needs, such as energy efficiency in data centres and defence applications, it is essential that the Netherlands invests in these technologies now.

The programme is structured around three work packages: chip design for chiplets, the development of production machines and metrology systems, and system design of multicomponent products, in which co-design plays a central role.

Participating organisations