On September 23, 2025, Fraunhofer/FMD and High Tech NL will host a webinar with a comprehensive overview of the APECS pilot program. This pilot program was developed to stimulate innovation in advanced packaging and heterogeneous system integration throughout Europe.

APECS pilot line

APECS (Advanced Packaging and Integration for Electronic Components and Systems) intends to establish itself as the pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems based on chiplets, QMI, RF, opto, sensor as well as passive components. It does this by:

• Combining the know-how of various partners, APECS will offer services, capabilities and training for European companies and research organizations to integrate and package chiplets and further advanced electronic components into novel electronic systems.
• Joining forces of Europes´ leading RTOs, the platform of capabilities to be developed will include novel characterization, quality assurance, testing & reliability methodologies and a System-Technology Co-Optimization (STCO) design framework to ensure quality, reliability, security, green manufacturing and fast production ramp-up in collaboration with manufacturing organizations.

For whom

This webinar is especially relevant for everyone active in the semiconductor domain; from chip design to assembly and test, from process development to equipment supply.

Programme

This session will feature presentations from:

• Ben van der Zon, Consultant Semicon en International Business, High Tech NL
• Felix Mohn, Manager Business Development, Fraunhofer/FMD
• Erik Jung, Senior Business Developer, Fraunhofer IZM

When

• Date: 23 September, 2025
• Time: 10:00 AM  - 11:00 AM
• Location: webinar

More information and registration

For detailed information and registration, please visit the High Tech NL website:

More information and registration